Out-of-bounds Read Affecting kernel-zfcpdump package, versions <5.14.21-150400.24.133.2
Threat Intelligence
The probability is the direct output of the EPSS model, and conveys an overall sense of the threat of exploitation in the wild. The percentile measures the EPSS probability relative to all known EPSS scores. Note: This data is updated daily, relying on the latest available EPSS model version. Check out the EPSS documentation for more details.
Do your applications use this vulnerable package?
In a few clicks we can analyze your entire application and see what components are vulnerable in your application, and suggest you quick fixes.
Test your applications- Snyk IDSNYK-SLES154-KERNELZFCPDUMP-8089693
- published25 Sept 2024
- disclosed24 Sept 2024
Introduced: 24 Sep 2024
CVE-2022-48871 (opens in a new tab)How to fix?
Upgrade SLES:15.4 kernel-zfcpdump to version 5.14.21-150400.24.133.2 or higher.
NVD Description
Note: Versions mentioned in the description apply only to the upstream kernel-zfcpdump package and not the kernel-zfcpdump package as distributed by SLES.
See How to fix? for SLES:15.4 relevant fixed versions and status.
In the Linux kernel, the following vulnerability has been resolved:
tty: serial: qcom-geni-serial: fix slab-out-of-bounds on RX FIFO buffer
Driver's probe allocates memory for RX FIFO (port->rx_fifo) based on default RX FIFO depth, e.g. 16. Later during serial startup the qcom_geni_serial_port_setup() updates the RX FIFO depth (port->rx_fifo_depth) to match real device capabilities, e.g. to 32.
The RX UART handle code will read "port->rx_fifo_depth" number of words into "port->rx_fifo" buffer, thus exceeding the bounds. This can be observed in certain configurations with Qualcomm Bluetooth HCI UART device and KASAN:
Bluetooth: hci0: QCA Product ID :0x00000010 Bluetooth: hci0: QCA SOC Version :0x400a0200 Bluetooth: hci0: QCA ROM Version :0x00000200 Bluetooth: hci0: QCA Patch Version:0x00000d2b Bluetooth: hci0: QCA controller version 0x02000200 Bluetooth: hci0: QCA Downloading qca/htbtfw20.tlv bluetooth hci0: Direct firmware load for qca/htbtfw20.tlv failed with error -2 Bluetooth: hci0: QCA Failed to request file: qca/htbtfw20.tlv (-2) Bluetooth: hci0: QCA Failed to download patch (-2)
BUG: KASAN: slab-out-of-bounds in handle_rx_uart+0xa8/0x18c Write of size 4 at addr ffff279347d578c0 by task swapper/0/0
CPU: 0 PID: 0 Comm: swapper/0 Not tainted 6.1.0-rt5-00350-gb2450b7e00be-dirty #26 Hardware name: Qualcomm Technologies, Inc. Robotics RB5 (DT) Call trace: dump_backtrace.part.0+0xe0/0xf0 show_stack+0x18/0x40 dump_stack_lvl+0x8c/0xb8 print_report+0x188/0x488 kasan_report+0xb4/0x100 __asan_store4+0x80/0xa4 handle_rx_uart+0xa8/0x18c qcom_geni_serial_handle_rx+0x84/0x9c qcom_geni_serial_isr+0x24c/0x760 __handle_irq_event_percpu+0x108/0x500 handle_irq_event+0x6c/0x110 handle_fasteoi_irq+0x138/0x2cc generic_handle_domain_irq+0x48/0x64
If the RX FIFO depth changes after probe, be sure to resize the buffer.
References
- https://www.suse.com/security/cve/CVE-2022-48871.html
- https://bugzilla.suse.com/1229509
- https://git.kernel.org/stable/c/894681682dbefdad917b88f86cde1069140a047a
- https://git.kernel.org/stable/c/b8caf69a6946e18ffebad49847e258f5b6d52ac2
- https://git.kernel.org/stable/c/cb53a3366eb28fed67850c80afa52075bb71a38a
- https://git.kernel.org/stable/c/fd524ca7fe45b8a06dca2dd546d62684a9768f95