CVE-2023-53242 Affecting kernel-obs-build package, versions <5.14.21-150500.55.124.1


Severity

Recommended
0.0
medium
0
10

Based on SUSE Linux Enterprise Server security rating.

Threat Intelligence

EPSS
0.03% (9th percentile)

Do your applications use this vulnerable package?

In a few clicks we can analyze your entire application and see what components are vulnerable in your application, and suggest you quick fixes.

Test your applications
  • Snyk IDSNYK-SLES155-KERNELOBSBUILD-13611157
  • published17 Oct 2025
  • disclosed16 Oct 2025

Introduced: 16 Oct 2025

NewCVE-2023-53242  (opens in a new tab)

How to fix?

Upgrade SLES:15.5 kernel-obs-build to version 5.14.21-150500.55.124.1 or higher.

NVD Description

Note: Versions mentioned in the description apply only to the upstream kernel-obs-build package and not the kernel-obs-build package as distributed by SLES. See How to fix? for SLES:15.5 relevant fixed versions and status.

In the Linux kernel, the following vulnerability has been resolved:

thermal/drivers/hisi: Drop second sensor hi3660

The commit 74c8e6bffbe1 ("driver core: Add __alloc_size hint to devm allocators") exposes a panic "BRK handler: Fatal exception" on the hi3660_thermal_probe funciton. This is because the function allocates memory for only one sensors array entry, but tries to fill up a second one.

Fix this by removing the unneeded second access.

CVSS Base Scores

version 3.1